SOLDER PASTE
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There is growing concern over lead residues in tin-lead alloys, where lead residues are dumped at landfill sites, and the environment is threatened by catastrophic pollution. In recent years, lead-free solder in the electronic manufacturing industry has received increasing attention.
The assessment and practical use of lead-free solder paste has encountered some difficulties, including determining a temperature suitable for both lead-free solder paste, printed circuit boards and components, and lead-free solder alloys that are less wettable than tin-lead alloys.
Therefore, the nature of the selected lead-free alloys and the use of solder paste flux considerations are very important.
We work closely with our customers in any solder product development and improvement to meet customer requirements. We manufacture a wide range of solder pastes with extensive support from our technical service team to meet your quality and service needs when using solder pastes.
◆Disposable Solder Paste
◆Water-soluble Solder Paste
◆Low - in the temperature Solder Paste
◆Special Paste for a particular used as a way
| Alloy No | Paste Flux Type | Alloy Composition | Solidus Temperature | Liquidus Temperature | Patent |
|---|---|---|---|---|---|
| S-305B | Disposable Type EM#330 Flux Classification: ROL1 | Sn-42/Bi-58 | 138 | Eutectic Temperature | No |
| S-305 | Disposable Type EM#520 Flux Classification: ROL0 | Sn-96.5/Ag-3.0/Cu-0.5 | 217 | 219 | Yes |
| S-305A | Disposable Type EM#530 Flux Classification: ROL0 | Sn-99.0/Ag-0.3/Cu-0.7 | 216 | 228 | Yes |
| S-305 | Halide-Free Disposable Type EM#505 Flux Classification: ROL0 | Sn-96.5/Ag-3.0/Cu-0.5 | 217 | 219 | Yes |
| S-305 | Disposable Type EM#506 Flux Classification: ROL0 | Sn-96.5/Ag-3.0/Cu-0.5 | 217 | 219 | Yes |
| S-305A | Disposable Type EM#508 Flux Classification: ROL0 | Sn-99.0/Ag-0.3/Cu-0.7 | 216 | 228 | Yes |
| S-305 | Disposable Type EM#630 Flux Classification: ROL1 | Sn-96.5/Ag-3.0/Cu-0.5 | 217 | 219 | Yes |
| S-305C | Disposable Type EM#880 Flux Classification: ORH0 | Sn-96.5/Ag-3.0/Cu-0.5 | 217 | 219 | Yes |
◎In The Temperature Range Of Lead-Free Alloy
| Part Number | SPR- 58DW | SPR- 335ZW | SPR- 135ZW | SPR- 260SJ | SPR- 320SJ | SPR- 450SJ | Test Method |
|---|---|---|---|---|---|---|---|
| Alloy Composition | Sn-42 | Sn-64.7 | Sn-64.0 | Sn-99.0 | Sn-98.5 | Sn-96.5 | |
| Bi-58 | Ag-0.3 | Ag-1.0 | Ag-0.3 | Ag-1.0 | Ag-3.0 | ||
| Bi-58 | Bi-58 | Bi-0.7 | Cu-0.5 | Cu-0.5 | |||
| Flux Color | Transparent | ||||||
| Activity Level | ROL - 0 - STD | IPC J - STD - 004 | |||||
| Halide Content | Pass | Pass | Pass | Pass | Pass | Pass | IPC J - STD - 004 |
| Coper Corrosion Test | Pass | Pass | Pass | Pass | Pass | Pass | IPC J - STD - 004 |
| Copper Mirror Test | Pass | Pass | Pass | Pass | Pass | Pass | IPC J - STD - 004 |
| Tack Force VS Humidity | 75% humidity and below less than 1g/mm2 | IPC J - STD - 005 | |||||
| Viscosity | 90% alloy composition 160 ± 20 Pas | IPC J - STD - 005 | |||||
| Stencil Life | More than 8 hours | 50% RH 23 ℃ | |||||
| Spread | Pass | Pass | Pass | Pass | Pass | Pass | JIS - Z - 3197 |
| Slump | Pass | Pass | Pass | Pass | Pass | Pass | IPC J - STD - 005 |